Evonik explores the future of 5G with key PCB material supplier
The global pandemic underlines the indispensability of internet , as online communications have largely taken the place of in-person communications due to social distancing requirements. Evonik continuously explores opportunities in the next-generation network such as 5G, together with its business partner Nan Ya.
On May 14, Evonik Taiwan and the Electronic Industry Team (EIT) organized a webinar with Nan Ya Plastics Corporation to discuss the potential business opportunities in the field of 5G. Nan Ya is one of the key players when it comes to Copper Clad Laminates (CCL) for Printed Circuit Boards (PCB), an integral part of 5G devices and base stations.
The webinar was opened with a presentation by the representative of Nan Ya about the requirements of material performance to produce PCB. Insight about the standards of 5G high-frequency applications were also shared. One of the critical factors to ensure higher transmission speed is that the CCL must have low Dielectric constant/Dissipation factor (Dk/Df), in order to reduce transmission loss as much as possible.
In response, Tony Sun, Senior Business Development Manager of Evonik Taiwan, introduced several Evonik products with application potential for 5G CCL for PCB, such asTAICROS, Methacrylate monomers, BMI and Polyvest. This was followed by a subsequent Q&A session, where participants raised questions and exchanged ideas.
Thomas Zechel, President of Evonik Taiwan, and Dr. Te-Chao Liao, Head of Nan Ya R&D Center and Vice President of Nan Ya Plastics, warped up the webinar and expressed wiliness of further cooperation in the field of 5G.
Evonik will keep collaborating with strong local partners like Nan Ya on the development of 5G products and solutions, in order to mutually benefit from the expected boom of 5G infrastructure.